Solder paste inspection (SPI). Most component placement quality issues in electronics manufacturing originate with solder paste application. At Proplace, we provide comprehensive solder paste inspection using an in-line SPI machine that checks paste application on every PCB.
AOI
Visual inspection is carried out using AOI (automated optical inspection) machines, which can detect potential solder bridges, component misalignment and other placement defects. Read more about our AOI machine in the SMD placement section
X-ray inspection
For the placement of more complex components, where visual inspection alone cannot provide the required quality control, we can also arrange X-ray inspection of printed circuit boards through our partners. This technology is particularly useful when assembling BGA chips, as X-rays let us see beneath the chip and verify the quality of the solder joints.
FCT
Functional testing can make a major contribution to increasing the proportion of defect-free products shipped. The customer can supply the functional testing equipment, or Proplace can manufacture it based on the customer’s specifications.
